Message from the President
I am Eiji HIGURASHI of Tohoku University, recently appointed President of the Japan Institute of Electronics Packaging, as successor to former President Fujisaki. I very keenly feel the weight of the mission and responsibility of this presidency, as well as a deep sense of resolve. Inheriting the proud legacy established and built up by past presidents and predecessors, and along with our directors and secretariat, I will do my utmost to advance the continued growth of the Institute. I would like take this opportunity to express my appreciation to the members of the Institute for their ongoing support and guidance.
With the fast pace of development of generative AI over the last few years, society as a whole finds itself on the brink of sweeping transformation. The rapid pace of technological progress and the wide range of applications hold immeasurable potential. It is said that “He who controls semiconductors controls the world”, and with the increasing strategic importance of high function semiconductors, countries around the world are ramping up their investment in R&D related to next-generation semiconductors. As we begin to see diminishing returns in performance gains from semiconductor miniaturization, there is an increasing trend towards leveraging advanced packaging and mounting technologies to drive semiconductor evolution, and the electronic packaging and mounting technologies promoted by the Institute are gaining in importance. With the exponential increase in the sheer volume of computations driven by generative AI, energy consumption is likely to surge, and electronics packaging and mounting technologies are expected to contribute significantly in addressing this critical global challenge. Without a doubt, the Institute has a vital role to play in the shaping of the new era.
The field of electronic packaging draws deeply from a range of academic disciplines, including electric and electronic engineering, semiconductor design, mechanical engineering, materials science and chemistry. For this reason, it is vital that people with diverse backgrounds and perspectives are given a forum for interaction and the exchange of ideas, and this I believe is the role of the Institute. These days, almost all of the papers and materials required for research and development can be accessed online, but it is widely accepted that innovation often springs from face-to-face dialogue among people with differing points of view. I am also committed to the active promotion of collaboration with other leading academic institutions around the world.
In addition, academic conferences are becoming increasingly important as forums for unearthing new talent. Going forward, as global competition intensifies, it goes without saying that Japan’s greatest resource for sustainable growth is “people”. The fostering of young talent who will be global leaders in this field is one of the core missions of the Institute. Many of the results of university-based research are presented by students at lecture meetings and symposiums. It is my hope that our colleagues in the corporate world will utilize these conferences as platforms for meeting talented university graduates.
Finally, having been privileged to have taken part in activities such as academic presentations and the operations of the Institute under the guidance and mentorship of my predecessors and fellow members, it is my intention to do my utmost, however slight that may be, to give back to the Institute that has given me so much over the years.
Department of Electronic Engineering, School of Engineering, Tohoku University
From the Preface of Vol.28 No.4
