Information

2023 International Conference on Electronics Packaging
(ICEP 2023)
Date: April 19-22, 2023
Venue: Civic Auditorium Sears Home Yume Hall (Kumamoto Pref., Kyushu area, Japan), On-site Only.

Notice

Call for Papers

We are waiting for your abstract submission.
Information of call for papers: Download
The abstract submission deadline is October 31, 2022.

We would like to ask you to prepare an abstract using the attached template. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. You must include the novel, original, and unpublished contents and state the purposes, methods, results, and conclusions clearly in the abstract.

Thank you very much for your contribution!