General Information

2019 International Conference on Electronics Packaging
(ICEP 2019)

Date:April 17-20, 2019
Venue:Toki Messe, Niigata

Notice

Call for Papers
We are waiting for your abstract submission.
Information of call for papers: English ver.   Japanese ver.

Please prepare an abstract using the attached template to help us better evaluate your submission. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. Figures and tables to support the point of the paper will receive positive considerations. Your abstract will be used for review purpose only and will not be included in the conference proceeding.

Thank you very much for your contribution!

Important Date

The abstract submission open: August 21,2018
The abstract deadline: October 31,2018
Notification of acceptance: December 13,2018
Final manuscript dead line: February 14,2019