About ICEP 2020

ICEP 2020 will be held from April 22 to 25, 2020 in Tokyo, Japan.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.


Organization

General Chair
Eiji Higurashi, National Institute of Advanced Industrial Science and Technology

General Vice Chair
Shigenori Aoki, LINTEC
Katsumi Miyama, Hokkaido University of Science
Akitsu Shigetou, National Institute for Materials Science

Operation Committee Chair
Katsumi Miyama, Hokkaido University of Science

Operation Committee Vice Chairs
Hajime Hirata, Toray Engineering
Koichi Hirata, Namics
Mitsuyo Miyauchi, ALPHA-DESIGN
Miki Mori, the University of Tokyo
Yoshio Nogami, Toray Engineering
Akira Yamauchi, National Institute of Technology, Gunma College

Operation Committee Members
Hidenobu Deguchi, Sekisui Chemical
Ryo Endoh, Toray Research Center
Jin Fujimura, ePRONICS
Maki Ito, Hitachi
Minami Kaneko, Nihon University
Hidetoshi Kitaura, Panasonic
Yoshiteru Kono, OMRON
Keishi Okamoto, Huawei Technologies Japan
Kazuo Shimokawa, Toshiba
Jun Shirakami, DIC
Takahito Watanabe, IBM Japan
Noriyasu “Notch” YAMANE, Mitsubishi Chemical
Akira Yamauchi, Bondtech
Akihiro Yanami, DAISHO DENSHI

Technical Program Committee Chair
Akitsu Shigetou, National Institute for Materials Science

Technical Program Committee Vice Chair
Shinya Takyu, LINTEC
Naotaka Tanaka, Hitachi Chemical
Yoshihiro Tomita, Intel

Advisory
Yasuhiro Ando, ABI Giken
Yoshitaka Fukuoka, Worldwide Electronic Integrated Substrate Technology
Masaru Ishizuka, Toyama Prefectural University
Kaoru Hashimoto, Meisei University
Kenzo Hatada, Atomnics Laboratory
Hideyuki Nishida, NEP Tech. S & S
Takashi Nukii, Kyoko University
Atsushi Okuno, Green Planets
Kanji Otsuka, Meisei University
Yuzo Shimada, NAMICS
Tadatomo Suga, Meisei University
Katsuaki Suganuma, Osaka University
Haruo Tabata, C-net
Shinichi Wakabayashi, Nagano Techno Foundation
Kishio Yokouchi, Japan Jisso-Interconnect Solutions Laboratory