About ICEP-IAAC2018

ICEP-IAAC 2018 will be held from April 17 to 21, 2018 in Kuwana, Mie, Japan.
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.
Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Yoshio Nogami, Toray Engineering

General Vice Chair
Hajime Hirata, Toray Engineering
Osamu Suzuki, Namics
Yoichi Taira, Keio University

Technical Program Committee Chair
Osamu Suzuki, Namics

Technical program Committee Vice Chair
Shigenori Aoki, Fujitsu Laboratories
Koichi Hasegawa, JSR
Eiji Higurashi, AIST
Toshihisa Nonaka, Hitachi Chemical
Akitsu Shigetou, NIMS

Operation Committee Chair
Hajime Hirata, Toray Engineering

Operation Committee Vice Chair
Katsumi Miyama, Hokkaido University of Science
Mitsuyo Miyauchi, Alpha Design
Miki Mori, The University of Tokyo

Publication Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Publication Vice Chair
Eiji Higurashi, AIST

Finance Chair
Masahiro Inoue, Gunma University

Finance Vice Chair
Tomoyuki Hatakeyama, Toyama Prefectural University