About ICEP 2022

ICEP 2022 will be held as a hybrid conference, combining on-site and online presentations, from May 11 to 14, 2022 in Sapporo, Hokkaido, Japan.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Katsumi Miyama, Hokkaido University of Science

General Vice Chairs
Tomoyuki Hatakeyama, Toyama Prefectural University
Eiji Higurashi, National Institute of Advanced Industrial Science and Technology
Akira Yamauchi, National Institute of Technology, Gunma College

Technical Program Committee Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Technical Program Committee Vice Chairs
Toyohiro Aoki, IBM Japan
Akitsu Shigetou, National Institute for Materials Science
Shinya Takyu, LINTEC

Operation Committee Chair
Akira Yamauchi, National Institute of Technology, Gunma College

Operation Committee Vice Chairs
Koichi Hirata, Namics
Mitsuyo Miyauchi, ALPHA-DESIGN

Publication Chair
Kiyokazu Yasuda, Osaka University

Finance Chair
Taiji Sakai, Fujitsu Interconnect Technologies