About ICEP 2017

ICEP 2017 will be held from April 19 to 22, 2017 in Tendo, Yamagata, Japan.  It is the largest international conference on electronic packaging in Japan.  It is jointly sponsored by IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society Japan Chapter, IMAPS (International Microelectronics and Packaging), and JIEP (The Japan Institute of Electronics Packaging).  The conference will have technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, manufacturing and processes, interconnection, optoelectronics, printed electronics and 3DIC Packaging.


Organization

General Chair
Shoji Uegaki, ASE Group

General Vice Chair
Yoshio Nogami, Toray Engineering
Osamu Suzuki, Namics
Kishio Yokouchi, Fujitsu Interconnect Technologies

Technical Program Committee Chair
Osamu Suzuki, Namics

Technical program Committee Vice Chair
Masahiro Inoue, Gunma University
Hitoshi Sakamoto, NEC
Akitsu Shigetou, NIMS
Yoichi Taira, Keio University
Kazushige Toriyama, Kyocera

Technical program Committee Members
Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology
Tomoyuki Abe, Fujitsu
Yasuhiro Ando
Fumio Uchikoba, Nihon University
Hideo Ohkuma, HTO
Tetsuya Ohnishi, Grand Joint Technology
Takayuki Ohba,
Kazuya Okamoto, Osaka University
Hiroshi Ozaki, Sony
Masaaki Oda, JAPERA
Yasumitsu Orii, Nagase
Yu Kondo, Olympus   
Shuji Sagara, Dai Nippon Printing  
Itsuro Shishido, Kyocera
Koichi Shibayama, Sekisui Chemical
Shinichi Nishi, Konica Minolta
Hiroshi Nishikawa, Osaka University
Toshihisa Nonaka, Hitachi Chemical
Nobuaki Hashimoto, Seiko Epson
Koichi Hasegawa, JSR
Tomoyuki Hatakeyama, Toyama Prefectural University
Sumito Hayashida, ASE Group
Shigeru Hiura, Toshiba
Eiji Higurashi, The University of Tokyo
Koichi Hirano, Panasonic 
Noriyuki Fujimori, Olympus
Hiroshi Hozoji, Hitachi
Tadao Yasunaga, Tohoku University
Jun Mizuno, Waseda University
Kiyokazu Yasuda, Osaka University
Yusuke Yasuda, Hitachi
Hiroshi Yamada, Toshiba
Shintaro Yamamichi, IBM Japan

Operation Committee Chair
yoshio Nogami, Toray Engineering

Operation Committee Vice Chair
Hajime Hirata, Toray Engineering
Mitsuyo Miyauchi, Alpha Design
Miki Mori, Toshiba

Publication Chair
Eiji Higurashi, The University of Tokyo

Finance Chair
Tomoyuki Hatakeyama, Toyama Prefectural University