About ICEP 2019

ICEP 2019 will be held from April 17 to 20, 2019 in Niigata, Japan.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Osamu Suzuki, Namics

General Vice Chair
Hajime Hirata, Toray Engineering
Eiji Higurashi, AIST/The University of Tokyo
Yoichi Taira, Keio University

Finance Chair
Shoichi Ishikawa, JIEP

Operation Committee Chair
Hajime Hirata, Toray Enjineering

Operation Committee Vice Chair
Katsumi Miyama, Hokkaido University of Science
Miki Mori, The University of Tokyo
Mitsuyo Miyauchi, ALPHA DESIGN
Yoshio Nogami, Toray Enjineering

Operation Committee Members
Akihiro Yanami, DAISHO DENSHI
Akira Yamauchi, Bondtech
Akira Yamauchi, National Institute of Technology,Gunma College
Hidenobu Deguchi, Sekisui Chemical
Hidetoshi Kitaura, Panasonic
Jun Shirakami, DIC
Kazuo Shimokawa, Toshiba
Keishi Okamoto, IBM JAPAN
Koichi Hirata, Namics
Maki Ito, Hitachi
Minami Kaneko, Nihon University
Osamu Kamogawa, Shanghai Air Water International trading
Ryo Endoh, Toray Research Center
Taiji Sakai, Fujitsu Laboratories
Takayuki Arioka, NAGASE
Tsunehiko Terada, Tatsuta Electric Wire & Cable
Yoshiteru Kono, OMRON

Publication Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Publication Member
Hitoshi Sakaamoto, Huawei Technologies Japan
Shigenori Aoki, Fujitsu Laboratories

Technical Program Committee Chair
Eiji Higurashi, AIST/The University of Tokyo

Technical Program Committee Vice Chair
Akitsu Shigetou, NIMS
Shigenori Aoki, Fujitsu Laboratories

Technical Program Committee Member
Fumio Uchukoba, Nihon University
Hideo Ohkuma, H.T.O
Hiroshi Hozoji, AIST
Hiroshi Nishikawa, Osaka University
Hiroshi Ozaki, Sony Semiconductor Soiutions
Hiroshi Yamada, Toshiba
Hitoshi Sakamoto, Huawei Technologies Japan
Jun Mizuno, Waseda University
Kazushige Toriyama, Kyocera Corporation
Kazuya Okamoto, Yamaguchi University
Keiji Yamada, Toshiba
Kiyokazu Yasuda, Osaka University
Koichi Hasegawa, JSR
Koichi Hirano, Panasonic
Koichi Shibayama, Sekisui Chemical
Masaaki Oda, Printed Electronics Network
Masahiro Aoyagi, AIST
Masahisa Fujino, AIST
Nobuaki Hashimoto, Suwa University of Science
Nobuyoshi Wakasugi, DENSO
Noriyuki Fujimori, OLINPUS
Shinichi Nishi, JAPERA
Shoji Uegaki
Shuji Sagara, Dai-Nippon Printing Co.,Ltd
Tadao Matsunaga, Tohoku University
Takahiro Arakawa, Tokyo Medical and Dental University
Takashi Kasahara, Hosei University
Takayuki Ohba, Tokyo Institute of Technology
Tetsuya Onishi, Grand Joint Technology
Tomoyuki Ave, Fujitsu
Tomoyuki Hatakeyama, Toyama Prefectural University
Toshihisa Nonaka, Hitachi Chemical
Toyohiro Aoki, IBM Japan
Ueda Masahide, Tokuyama
Yasuhiro Morikawa, ULVAC
Yasumitsu Orii, Nagase
Yoichiro Sato, AGC
Yoshinari Ikeda, Fuji Electric
Yoshiro Tomita, Intel
Yu Kondo, OLINPUS

Advisory
Yasuhiro Ando, ABI Giken
Yoshitaka Fukuoka, WEIST
Kaoru Hashimoto, Meisei University
Kenzo Hatada, Atomnics Laboratory
Masaru Ishizuka, Toyama Prefectural University
Fumiyo Miyashiro, Yokohama Jisso Consortium
Hideyuki Nishida, NEP Tech
Takashi Nukii, Kyoko University
Atsushi Okuno, Green Planets
Kenji Otuka, Meisei University
Yuzo Shimada, NAMICS
Katsuaki Suganuma, Osaka University
Haruo Tabata, Circuit Net Work
Kishio Yokouchi, J2IS