ICEP2017 Advance Program

April 19
A B C D E
12:30


13:10
Award Ceremony
13:10



14:10
Keynote Lecture
Reinventing the Technology Roadmap
William T. Chen, ASE Group
14:10



15:10
Keynote Lecture
Organic LEDs for Displays and Lighting
Junji Kido, Yamagata University
15:10

16:10
Poster Session / Break
16:10


17:10
Keynote Lecture
3D-Integration and Wafer Bonding for MEMS Packaging: Overview and examples 
Joerg Froemel, Tohoku University

17:10


18:10
Keynote Lecture
Converter-in-Package: Realising the Potential of Wide Band-Gap Power Electronics
C Mark Johnson, UK Engineering and Physical Sciences Research Council (EPSRC) Centre for Power Electronics
18:30

20:30
Welcome Reception
Takinoyu Hotel


April 20
A B C D E
9:00














































10:40
TA1: iMAPS Session: The New Shape of Electronics: Functional 3D Additive Manufacturing
TA1-1 
<Session Invited>
Printed Electronics and Additive Packaging for Microwave Applications
Susan Trulli, Raytheon Integrated Defense Systems / USA





TA1-2 <Session Invited>
The Next Generation EDA System for 3D Printing Technologies
Kazuhiro Kariya, Zuken / Japan







TA1-3 <Session Invited>
Functional Inkjet 3D Printing System for Customized Electronics
Kenji Tsukada, Akihiro Kawajiri, Yoshitaka Hashimoto, Katsuaki Makihara, Ryojiro Tominaga, Masatoshi Fujita, Takeshi Sato, Fuji Machine Mfg. / Japan



TA1-4
Panel Discussion

TB1: Advanced Packaging-1
TB1-1 <Session Invited>
Low Temperature Direct Cu Bonding for MEMS Packaging
Jenn-Ming Song1, Sin-Yong Liang1, Po-Hao Chiang1, Jing-Yuan Lin2, 1National Chung Hsing University, 2Industrial Technology Research Institute / Taiwan





TB1-2
Solder Joint Reliability Analysis for Large Size WLCSP
Mengkai Shih, Hsin-Chih Shih, Ying-Chih Lee, Advanced Semiconductor Engineering (ASE) / Taiwan



TB1-3
Parameters Study of Thermomechanical Reliability of Board-level Fan-out Package
Mengkai Shih, Ying-Chih Lee, Ryan Chen, Advanced Semiconductor Engineering (ASE) / Taiwan





TB1-4
Folded FPC Module for Hearing Aids
Susie Marie Johansson, John Edward Dzarnoski, Starkey Hearing Technologies / USA


TC1: Materials and Processes-1
TC1-1
The Effect of Size and Shape of Ag Particles for Mechanical Properties of Ag Sinter Joining Evaluated by Micro-compression Test
Chuantong Chen1, Shijo Nagao1, Tohru Sugahara1, Hao Zhang1, Katsuaki Suganuma1, Tomohito Iwashige2, Kazuhiko Sugiura2, Kazuhiro Tsuruta2, 1Osaka University, 2DENSO / Japan

TC1-2

Study on Influence of Under-Fill Material Properties on the Reliability of FC-BGA
Naoya Suzuki, Hisato Takahashi, Hitachi Chemical / Japan




TC1-3
Cancelled
Effect of Moisture on the Curing Behavior of Mold Compound
Chia-Yu Chang, Texas Instruments / Taiwan








TC1-4
Cancelled
Electrical and Thermal Conduction Mechanisms in Novel Isotropic Conductive Adhesive
Helge Kristiansen1,2, Sigurd Pettersen2, Susanne Helland3, Robert Schlag4, Erik Kalland3, Corinna Grosse4, 1Norwegian University of Science and Technology, 2Conpart, 3Mosaic Solutions / Norway, 4Berliner Nanotest und Design / Germany

TD1: Thermal Management-1
TD1-1
Improvement of Cooling Performance of Impinging Air by Intermittent Flow Control - relationship between nozzle diameter and cooling performance
Taiki Furusawa1, Takashi Fukue1, Hidemi Shirakawa2, Koichi Hirose1, 1Iwate University, 2National Institute of Technology, Toyama College / Japan

TD1-2
Heat Transfer Performance of Uni-directional Porous Media for Cooling of SiC-based on-vehicle Inverter
Kio Takai, Kazuhisa Yuki, Risako Kibushi, Noriyuki Unno, Kohei Yuki, Tokyo University of Science -Yamaguchi / Japan

TD1-3
Comparison of Thermal Properties Between Si and SiC Power MOSFET using Electro-Thermal Analysis
Risako Kibushi1, Tomoyuki Hatakeyama2, Kazuhisa Yuki1, Noriyuki Unno1, Masaru Ishizuka2, 1Tokyo University of Science -Yamaguchi, 2Toyama Prefectural University / Japan

TD1-4
Thermal Management of Silicon Micro Robot Driven by Neural Networks IC control SMA Actuator
Minami Takato, Yuya Nakata, Yuto Uchiumi, Taisuke Tanaka, Ken Saito, Fumio Uchikoba, Nihon University / Japan
TE1: RF
TE1-1<Session Invited>
CMOS Class-E Power Amplifier Module with CPW Bonding Wires for 5GHz Application
Haruichi Kanaya, Kyushu University / Japan







TE1-2
Transmission Line Signal Radiation Pattern by Near-Field Measurement
Min Chou, Kai-Wen Liang, Meng-Hua Tu, Sung-Mao Wu, National University of Kaohsiung / Taiwan



TE1-3
A Cross Type of Unbalanced Dipole Antenna with the Bent Type of Semicircular and Trapezoidal Radiating Elements
Tomohiro Yamada1, Fukuro Koshiji1, Kohji Koshiji2, 1Tokyo Polytechnic University, 2Tokyo University of Science / Japan



TE1-4
A Self-Complementary Antenna for WLAN and WiMAX Applications Using Traditional Molding Skills and Techniques
Atsushi Maeda, Tsuyoshi Haga, Yoshiteru Watanabe, IBUKI / Japan
10:40

10:50
Break
10:50









































12:30
TA2: Taiwan Session
TA2-1 <Session Invited>
Reliability Assessment using Modified Energy Based Model for WLCSP Solder Joints
Cheng Yen Tsou, Tien Ning Chang, Kai Chiang Wu, Kuo Ning Chiang, National Tsing Hua University / Taiwan









TA2-2 <Session Invited>
Innovated Ultra-thin and Super Fine-pitch Panel RDL Substrate Manufacturing for Advanced Package
Yu-Hwa Chen, Unimicron / Taiwan







TA2-3 <Session Invited>
Low Temperature Interconnect Fabrication using Submicron/Nano Metallic Particles
Jenn-Ming Song, Chi-Nan Cheng, Guo-Lun Huang, National Chung Hsing University / Taiwan


TA2-4 <Session Invited>
Panel Level Fan Out Technology
Daniel Fann, PTI / Taiwan
TB2:Advanced Packaging-2
TB2-1 <Session Invited>
Innovative Laser Enabled Dual Damascene Process for Ultra-fine Line Multi-layer Routing for Advanced Packaging
Habib Hichri, SUSS MicroTec / USA
 










TB2-2
Study of Influence of Mechanical Property of Temporary Bonding Adhesive on Warpage of FO-WLP
Keisuke Nishido, Kouji Hamaguchi, Takekoshi Masaaki, Naoya Suzuki, Toshihisa Nonaka, Hitachi Chemical / Japan





TB2-3
Effect of External Bending Stress on Device Embedded Substrate
Katsumi MiyamaI1, Yoshihisa Katoh2, 1Hokkaido University of Science, 2Fukuoka University / Japan
TC2: Materials and Processes-2
TC2-1
An Investigation on Ultrathin Wafer Dicing by Ultrafast Laser with High Density Plasma Etching
Hsiang-Chen Hsu1, Shih-Jeh Wu1, Wen-Fei Lin1,2, Shen-Li Fu1, 1I-Shou University, 2E&R Engineering / Taiwan









TC2-2
Real Time X-ray Imaging of Soldering Processes at the SPring-8 Synchrotron
Kazuhiro Nogita1, Arif Salleh2, Guang Zeng3, Stuart McDonald1, Christopher Gourlay3, Hideyuki Yasuda4, 1The University of Queensland / Australia, 2Universiti Malaysia Perlis / Malaysia, 3Imperial College / UK, 4Kyoto University / Japan

TC2-3
Fabrication of Self-standing Curved Film with Pillar Arrays by Large Area Spherical Soft-UV Imprint Lithography
Takumi Kamibayashi, Hiroyuki Kuwae, Atsuki Nobori, Shuichi Shoji, Jun Mizuno, Waseda University


TC2-4
Fine Pitch Plating Resist for High Density FO-WLP
Makoto Katsurayama, Hirokazu Ito, Hisanori Akimaru, Tomoyuki Matsumoto, Hirokazu Sakakibara, Kenji Okamoto, Koichi Hasegawa, JSR / Japan
TD2: Thermal Management-2
TD2-1
Immersion Cooling Technology of SiC-based Inverter by Anti-freezing Liquid with Subcooled Boiling
Tadashi Furusho, Kazuhisa Yuki, Kibushi Risako, Noriyuki Unno, Koichi Suzuki, Tokyo University of Science-Yamaguchi / Japan








TD2-2
Advanced Cooling Technology via Boiling Heat Transfer Considering the Wettability of a Heating Surface
Noriyuki Unno1, Xiang-Yi Jia1, Kazuhisa Yuki1, Risako Kibushi1, Shin-ichi Satake2, Suzuki Koichi2, 1Tokyo University of Science-
Yamaguchi, 2Tokyo University of Science / Japan


TD2-3
Cooling Augmentation of Subcooled Boiling Liquid by a Nano-particle Coated Surface
Yoshito Iwanaga, Kazuhisa Yuki, Noriyuki Unno, Risako Kibushi, Koichi Suzuki, Tokyo University of Science Yamaguchi / Japan


TD2-4
Liquid-Gas Heat Exchanger for Low Pressure Refrigerant Application
Nirmal-Singh Rajput, Asuka Matsuba, Hisato Sakuma, Minoru Yoshikawa, NEC / Japan
TE2: Optelectronics
TE2-1
High Density Optical and Electrical Interfaces for Chip-scale Silicon Photonic Receiver
Koichi Takemura1, Yasuhiro Ibusuki1, Akio Ukita1, Mitsuru Kurihara1, Keizo Kinoshita1, Daisuke Okamoto1, Junichi Fujikata1, Kenichiro Yashiki1, Yasuyuki Suzuki1, Tsuyoshi Horikawa1,2, Tohru Mogami1, Kazuhiko Kurata1, 1Photonics Electronics Technology Research Association, 2National Institute of Advanced Industrial Science and Technology / Japan

TE2-2
Integration of Optical Transceivers for Servers
Yoichi Taira, Keio University / Japan









TE2-3
Packaging of UV Light-Emitting Diodes with a Stacked Silicon Reflector for Focused UV Emission
Xing Qiu, Jeffery C. C. Lo, S. W. Ricky Lee, The Hong Kong University of Science and Technology / Hong Kong

TE2-4
Design and Fabrication for Low Loss Channel-Shuffling Polymer Waveguides
Kohei Abe, Yoichi Taira, Takaaki Ishigure, Keio University / Japan

12:30

13:30
Lunch Time
13:30













































15:10
TA3: Korea Session
TA3-1 <Session Invited>
Preparation and Properties of Passivation Film Layers Spray Coated on Flexible CIGS Solar Cells
Ho Jung Chang, Sang Hee Lee, Byung Min Park, Young Chul Chang, Dankook University / Korea



TA3-2 <Session Invited>
Formation of Through-Silicon-Vias by Tin Filling Processes using Pressure Infiltration and Electrodeposition/Reflow
Tae Sung Oh, Donghyun Park, Jae-Hwan Kim, Hongik University / Korea


TA3-3 <Session Invited>
Effects of Ultrasonic on the Adhesion of Cu/Non-conductive Substrates in Electroless Copper Plating
Jae-Ho Lee1, Ju-Seok Kang1, Jinuk Lee2, Hyun-Woo Kwon2, 1Hongik Univeristy, 2Samsung Electro-
Mechanics / Korea


TA3-4
<Session Invited>
Electroplating for the Ni Probe Tip Nam Gil Kim, Yong-Bin Sun, Kyonggi University / Korea
TB3: Power Electronics Integration-1
TB3-1
Silver Sinter Joining for WBG Die-attach
Katsuaki Suganuma, Shijo Nagao, Toru Sugahara, Hao Zhang, Jinting Jiu, Osaka University / Japan





TB3-2
Laserbonding instead of Ultrasonic Wire Bonding - an alternative joining technology for power applications
Josef Sedlmair1, Benjamin Mehlmann1, Alexander Olowinsky2, 1F&K Delvotec Bondtechnik, 2Fraunhofer IZM / Germany

TB3-3
First Failure Point of a SiC Power Module with Sintered Ag Die-Attach on Reliability Tests
Kazuhiko Sugiura1, Tomohito Iwashige1, Kazuhiro Tsuruta1, Chuantong Chen2, Shijo Nagao2, Hao Zhang2, Tohru Sugahara2, Katsuaki Suganuma2, 1Denso, 2Osaka University / Japan

TB3-4
High Temperature SiC Power Device Realized by Electroless Plating Diffusion Barrier for Ag Sinter Die-attach
Shinya Seki1,2, Akio Shimoyama2, Hao Zhang2, Seigo Kurosaka3, Takuo Sugioka4, Hirofumi Fujita2, Keiji Yamamura2, Tetsuro Muramatsu2, Tohru Sugahara2, Shijo Nagao2, Katsuaki Suganuma2, 1Toray Research Center, 2Osaka University, 3Uyemura, 4Nippon Shokubai / Japan

TC3: Mterials and Processes-3
TC3-1 <Session Invited> 50min
Corundmu-structured α-Ga2O3-based Alloys for Future Power Device Aapplications
Kentaro Kaneko1, Masaya Oda2, Toshimi Hitora2, Shizuo Fujita1, 1Kyoto University, 2FLOSFIA / Japan














TC3-2
Electroless Ni-P Plating Applicable to Fine Pattern

Hiroki Seto, Toshiya Murata, Okuno Chemical Industries / Japan






TC3-3
The Study of Nano Anchoring Copper Foil for PWB
Makiko Sato, Osamu Suzuki, Naoki Obata, Yoshinobu Kokaji, Ken Okubo, NAMICS / Japan

TD3: Interconnection-1
TD3-1 Cancelled
Flip Chip Joining with Low Temperature Solders and Thermal Gradient Bonding
Toyohiro Aoki, Eiji Nakamura, Takashi Hisada, Hiroyuki Mori, Shintaro Yamamichi, IBM Japan / Japan



TD3-2
Effects of Cu Plating Formulas on the Solder Joint Reactions
Chih-Ming Chen, Hsuan Lee, National Chung Hsing University / Taiwan





TD3-3
Effect of Ag-11Au-4.5Pd Alloy Bonding Wire Properties and Structure on Bond Strengths and Reliability
Jun Cao1,2, JunLing Fan3, WeiXing Wu1, 1HeNan Polytechnic University, 2HeNan Youk Electronic Material, 3Jiaozuo University / China

TE3: DMR-E
TE3-1
Comprehensive Analysis on SCM Specifications for High-
Performance SCM/NAND Flash Hybrid SSD with Through-Silicon Via

Tomoaki Yamada, Atsuya Suzuki, Yusuke Sugiyama, Chihiro Matsui, Ken Takeuchi, Chuo University / Japan


TE3-2
A Study on Frequency Dispersion of Transmission Characteristics of Shielded-Flexible Printed Circuits
Yoshiki Kayano1, Hiroshi Inoue2, 1The University of Electro-
Communications, 2The Open University of Japan - Akita Study Center / Japan


TE3-3
High Impedance Design and Investigation using TDR for Fine Lines on High Density Organic Substrate
Hung-Chun Kuo, Fu-Chen Chu, Chen-Chao Wang, Chih-Pin Hung, Advanced Semiconductor Engineering / Taiwan



TE3-4
Cancelled
System PDN Design Exploration and Sensitivity Analysis using RLC Synthesized Models for DDR SI/PI Co-simulations
Javid Mohamed, Tim Michalka, Selman Ozbayat, Gerardo Romo Luevano, Venkat Satagopan, Qualcomm Technologies / USA

15:10

16:10
Poster Session / Break
16:10

































































17:50
TA4: iNEMI Session
TA4-1 <Session Invited>
Packaging and Component Substrates Technology Roadmap Chapter Overview and Future Direction through Technology Gaps
Bill Bader1, Chuck Richardson2, Masahiro Tsuriya2, 1iNEMI / USA




TA4-2
Using Flower of Sulfur Chamber to Test Creep Corrosion on PCBs
Haley Fu1, Prabjit Singh2, Dem Lee3, Jeffrey Lee3, Karlos Guo4, Julie Liu4, Simon Lee5, Geoffrey Tong5, Chen Xu6, 1iNEMI / China, 2IBM / USA, 3iST-Integrated Service Technology / Taiwan, 4Lenovo (Beijing) / China, 5The Dow Chemical / Taiwan, Hong Kong, 6Nokia / USA

TA4-3
Inspection/ Metrology Benchmarking on Fine Pitch Design Substrate for Advanced Packages
Feng Xue1, Hiroyuki Watanabe2, Cindy Han3, Masahiro Tsuriya 4, Charles Reynolds5, Thomas Wassic 5, Pomerantz Glenn5, 1IBM Systems Supply Chain Engineering / USA, 2Ibiden / Japan, 3Wistron / USA, 4iNEMI / Japan, 5IBM Systems Packaging Development / USA

TA4-4
Benchmarking Study for High-
Temperature and High-Reliability Pb-Free Die-Attach Material Technologies and Expectations

Lim Sze Pei1, Binghua Pan2, Hongwen Zhang1, John Holaday3, Wayne Ng4, Bosgum Wu5, Masahiro Tsuriya6, 11Indium, 2Delphi, 3Purdue University / USA, 4Nihon Superior / Japan, 5Wistron / USA, 6iNEMI / Japan

TB4: Power Electronics Integration-2
TB4-1
Reliability of POL-kw Power Modules
Kaustubh Nagarkar1, Arun Gowda1, Liang Yin1, Risto Tuominen2, Christopher Kapusta1, Paul Gillespie1, Donna Sherman1, Tammy Johnson1, Shingo Hayashibe3, Hitoshi Ito3, Tadashi Arai3, 1GE Global Research, 2GE Consultant, 3Shinko Electric Industries / Japan

TB4-2
Packaging IGBT Modules by Rapid Sintering of Nanosilver Paste in a Current Way
Yunhui Mei1, Yijing Xie1, Shuangtao Feng1, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Tech / USA




TB4-3
Packaging Technology of Medium Power Module for Automotive Applications
Ayako Shimoduma1, Hiromasa Hayashi1, Shingo Higuchi1, Yoshitsugu Sakamoto1, Sakie Okada2, 1Denso, 2Senju Metal Industry / Japan





TB4-4
Microstructural Inhomogeneity of Silver Sinter Joint Influenced by Solvent
Hao Zhang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma, Osaka University / Japan






TB4-5
Thermal Resistance Evaluation of Die-attach  Made of Nano-composite Cu/Sn TLPS Paste in SiC Power Module
Fumiki Kato1, Fengqun Lang1, Hiroshi Nakagawa1, Hiroshi Yamaguchi1, Ryuji Kimura2, Keiji Okada2, Hiroaki Shindo2, Tatsuya Ooi2, Rei Tamaki2, Shigenobu Sekine2, Hiroshi Sato1, 1National Institute of Advanced Industrial Science and Technology, 2Napra / Japan                                  (18:15)

TC4: Materials and Processes-4
TC4-1
Low Temperature Direct Bonding of Polyoxymethylene (POM) through Self Assembled Monolayers (SAM)
Weixin Fu, Hiroyuki Kuwae, Bo Ma, Shuichi Shouji, Jun Mizuno, Waseda University / Japan




TC4-2
Cu-Sn Based Joint Material Having IMC Forming Control Capabilities
Hiroaki Ikeda1,2, Shigenobu Sekine1, Ryuji Kimura1, Koichi Shimokawa1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1, Rei Tamaki1, Makoto Nagata2, 1Napra, 2Kobe University / Japan


TC4-3
The Effect of Surface Activation Process for the GaAs Device Properties
Masahisa Fujino1, Nobuto Managaki2, Hiroshi Yamada2, Tadatomo Suga1, 1The University of Tokyo, 2Toshiba / Japan




TD4: Interconnection-2
TD4-1 <Session Invited>
Surface-activated Bonding of III-V Compound Semiconductors and Si for Fabricating Hybrid Tandem Solar Cells
Naoteru Shigekawa, Jianbo Liang, Osaka City University /Japan





TD4-2
Role of Bi in Microstructure Formation and Reliability of Sn-Cu-Ni and Sn-Ag-Cu Based BGAs on Cu Metallization
Sergey Belyakov1, Takatoshi Nishimura2, Keith Sweatman2, Kazuhiro Nogita3, Christipher Gourlay1, 1Imperial College London / UK, 2Nihon Superior / Japan, 3University of Queensland / Australia

TD4-3
Cancelled
Impact of Sintering Parameters in Pressureless Sinter Joint on Silver Substrate
Ling Xin Yong, Juo Yan Tan, Heraeus Material Singapore / Singapore









TD4-4 Cancelled
Platform Power Rails Merger and Innovative Noise Isolation Approach
Fern Nee Tan, Hon Wah Chew, Paik Wen Ong, Mohd Shahrir Tamrin, Ji Yun Chuah, Chee Lun Foo, Intel Microelectronics (M) / Malaysia









TE4: DMR-Mechanical
TE4-1
Canary Devices for Through Silicon Vias - a condition monitoring approach

Kathleen Jerchel1, Arian Grams2, Nils F. Nissen2, Tadatomo Suga1, Klaus-Dieter Lang3, 1The University of Tokyo / Japan, 2Fraunhofer Institute for Reliability and Microintegration, 3Technische Universität / Germany

TE4-2
A MEMS-based measurement approach for contact normal force measurement in crimp terminals
Soeren Majcherek, Joerg Fochtmann, Markus Barth, University of Magdeburg / Germany




TE4-3
Novel Wafer Level Packaging for Large Die Size Device

Tien-Ning Chang, Cheng-Yen Tsou, Pao-Hsiung Wang, Kou-Ning Chiang, National Tsing Hua University / Taiwan







TE4-4
Investigation of the Warpage Modeling Technique for Thick Multi-chip Module Encapsulated by Compression Molding
Kosuke Suzuki, Shinya Uchibori, Yuki Sanada, Atsushi Kashiwazaki, Masaji Imada, Denso / Japan


April 21
A B C D E
9:00








































10:40
FA1: IEEE CPMT Session: Heterogeneous Integration Roadmap
FA1-1 <Session Invited>
Heterogeneous Integration - The Enabler for Next Generation Packaging -
Bill Bottoms, Advanced Polymer Monitoring Technologies / USA




FA1-2 <Session Invited>
Overview of Heterogeneous Integration Roadmap
Bill Chen, ASE Global / USA






FA1-3
Panel Discussion
FB1: Materials and Processes-5
FB1-1
High Thermal Sintering Paste for Power Device
Kyeongsool Seong, Toshihiro Iwasaki, Takashi Nakamura, Shotaro Sakumoto, J-Devices / Japan





FB1-2
Improved Adhesion of Plating Copper Metal on Various Substrates by Controlled Interface of Ag Nanoparticles and Thin Polymer Layer
Norimasa Fukazawa, Wataru Fujikawa, Akira Murakawa, Jun Shirakami, DIC / Japan

FB1-3
Caltrop Cupric Oxide Particles Synthesized by X-ray Photochemical Reaction
Akinobu Yamaguchi1, Ikuo Okada2, Takao Fukuoka1, Yuichi Utsumi1, 1University of Hyogo, 2Nagoya University / Japan


FB1-4
Effect of Molecular Weight of PVA on the Reactivity and Stabilty Behavior of Adhesive
Yu-Chen Kao, Meei-Yu Hsu, Yi-Chun Chen, Kai-Chi Chen, Industrial Technology Research Institute / Taiwan

FC1:Thermal Management-3
FC1-1
Relationship between Vacuum Degree and Measurement Accuracy of Thermal Conductivity using Quasi-Steady State Measurement
Jumpei Hatakeyama, Koichi Hirose, Michimasa Uchidate, Takashi Fukue, Iwate University / Japan


FC1-2
Heat Pipes as Thermal Solution for PCBs
Jonathan Silvano de Sousa1, Paul Fulmek2, Michael Unger2, Johann Nicolics21AT&S Austria Technologie & Systemtechnik, 2Technische Universit¨at Wien / Austria

FC1-3
Study of Temperature Rise of Small Chip Components in case of Dense Mounting
Yoshinori Aruga1, Koichi Hirasawa1, Hirotoshi Aoki1, Hirotoshi Aoki2, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1KOA, 2Toyama Prefectural University / Japan

FC1-4
Basic Investigation of Cooling Performance at Upstream Side of Bend to Develop 1-Dimensional Thermal Design Scheme
Jun Ikehata1, Kota Kobayashi1, Takashi Fukue1, Koichi Hirose1, Yosuke Hata2, Hiroyuki Ishikawa2, 1Iwate University, 2Brother Industries / Japan
FD1: Printed Electronics-1
FD1-1 <Session Invited> 50min
Developments of High Precision Printing Processes for Fabricating the Flexible Electronics
Hirobumi Ushijima, Yasuyuki Kusaka, Mariko Fujita, Ken-ichi Nomura, Shusuke Kanazawa, Yoshinori Horii, Koji Abe, Noritaka Yamamoto, AIST / Japan












FD1-2 <Session Invited>50min
Newly Developed Silver Nanoparticle Ink for Organic TFT Circuits Fabricated with High Resolution Printing System
Daisuke Kumaki, Yamagata University / Japan



FE1: N-MEMS
FE1-1 <Session Invited>
Mouthguard Biosensor Integrated with Wireless Module for Monitoring Human Oral Information
Takahiro Arakawa, Keisuke Tomoto, Zhiwei Zhang, Hiroki Nitta, Koji Toma, Shuhei Takeuchi, Toshiaki Sekita, Shunsuke Minakuchi, Kohji Mitsubayashi, Tokyo Medical and Dental University / Japan

FE1-2
Wireless Monitoring of Mouse by Ultra-small and Low Power Implantable Sensor Node
Jian Lu1, Kouichi Serizawa1, Mizuho Sato2, Lan Zhang1, Ryutaro Maeda1, Atsushi Toyota2, 1AIST, 2Ibaraki University / Japan

FE1-3
Development of High Resolution Electrostatic Tactile Display
Hiroki Ishizuka, Katsuyori Suzuki, Kyohei Terao, Hidekuni Takao, Husao Shimokawa, Kagawa University / Japan



FE1-4
Formation of Extremely High-Aspect Si-Patterns with Smooth Sidewall for MEMS and X-ray Devices

Hayato Komatsu1, Wataru Yashiro2, Hidemi Kato2, Johji Kagami3, Kentaro Totsu2, Masashi Nakao2, 1Miyagi Prefectural Government, 2Tohoku University, 3Shinko Seiki / Japan
10:40

10:50

Break
10:50




































12:30
FA2: SMTA Pan Pacific Session : Strategies for High Volume/High Mix Manufacturing
FA2-1<Session Invited> 10min
Strategies for High Volume/High Mix Manufacturing
Charles E. Bauer, TechLead Corporation / USA

FA2-2<Session Invited> 30min
Intelligent Automation; Key Factor for High Mix Manufacturing
Horatio Quinones, FDCS LLC / USA








FA2-3<Session Invited> 30min
3D & Printed Electronics Manufacturing Strategies
Christopher Bailey, University of Greenwich / UK







FA2-4<Session Invited> 30min
Panel Processing for High Volume/High Mix Manufacturing
Rolf Aschenbrenner, Frauhofer IZM / Germany
FB2: Materials and Processes-6
FB2-1<Session Invited> 50min
TBD
Jin Kawakita, National Institute for Materials Science / Japan















FB2-2
Advanced Materials with Low Dielectric Properties and Highly Thermal Conductivity

Wen-Pin Ting, Feng-Po Tseng, Kuo-Chan Chiou, Industrial Technology Research Institute / Taiwan



FB2-3
Study of High UPH TCB Process with Slow Cure NCP
Hiroki Myodo, Yukihiro Ikeda, Yusuke Kamata, Masaaki Hoshiyama, NAMICS / Japan
FC2: Thermal Management-4
FC2-1
Development of Conductive Fusion Technology
Maciej Patelka, Nick Krasco, Cathy Trumble, NAMICS / USA



FC2-2
New Materials with Extremely High Thermal Conductivity Coefficient
Andrzej Moscicki1, Tomasz Falat2, Andrzej Kinart1, Mohamad Abo Ras3, 1Amepox Microelectronics, 2Wroclaw University of Technology / Poland, 3Berliner Nanotest & Design / Germany

FC2-3

Thermal Transient Test of GaN HEMT Devices
Tomoaki Hara1, Kentaro Yanai2, 1Mentor Graphics Japan, 2Omron / Japan






FC2-4
Cancelled
Reliability Testing of Ceramic Capacitors with Thermal Transient Method
Sarkany Zoltan, Rencz Marta, Mentor Graphics / Hungary


FD2: Printed Electronics-2
FD2-1 <Session Invited>
Print and Imprint Method for Nanoimprint Lithography with High-viscosity Photo-curable Resins
Takahiro Nakamura, Masaru Nakagawa, Tohoku University / Japan


FD2-2
UV-assisted 3D-printing of Soft Ferrite Magnetic Components for Power Electronics Integration
Guo-quan Lu1,2, Lanbing Liu1, Ting Ge1, Yi Yan1, Khai Ngo11, 1Virginia Tech / USA, 2Tianjin University / China



FD2-3
Imaging the Patterning Step of R2S Microcontact Printing
Yasuyuki Kusaka, Shusuke Kanazawa, Noritaka Yamamoto, Hirobumi Ushijima, National Institute of Advanced Industrial Science and Technology / Japan

FE2: Fan-out Packaging Technology-1
FE2-1 <Session Invited>
Fanout WLP Technology as an Wafer Level System in Packaging (SiP) Solution
Lewis Kang, Nepes / Korea


FE2-2 <Sesison Invited>
Carrier Glass Substrates for Fan-out Wafer/Panel Level Packaging
Kazutaka Hayashi, Asahi Glass / Japan






FE2-3 <Session Invited>
Recent Progress in Low Temperature Curable Photosensitive Dielectric

Tetsuya Enomoto, Satoshi Abe, Daisaku Matsukawa, Tadamitsu Nakamura, Nobuyuki Saito, Masayuki Ohe, Noriyuki Yamazaki,  Takeharu Motobe, Hitachi Chemical DuPont MicroSystems / Japan

FE2-4 <Session Invited>
Encapsulation Processes and Materials for Advanced Package
Joji Yukimaru, Sauyu Rec / Japan

12:30

13:30
Lunch Time
13:30


















































15:10
FA3: Fan-out Packaging Technology-2
FA3-1
<Session Invited>
FO-WLP Market and Technology Trends
E. Jan Vardaman, TechSearch International / USA




FA3-2

New Wave Fan-out Package for Heterogeneous Integration
Shin-Hua Chao, ASE Group / Taiwan








FA3-3 <Session Invited> 50min
Trends in Fan-out Wafer and Panel Level Packaging
Tanja Braun, Markus Wöhrmann, Michael Töpper, Karl-Friedrich Becker, Rolf Aschenbrenner, Klaus-Dieter Lang, Fraunhofer IZM / Germany

















FB3: Materials and Processes-7
FB3-1
Hi-Pb Solder Voiding Reduction for a High Power QFN Module
Ariel Jan V. Sadural, Laura May Antoinette D. Clemente, Texas Instruments Clark / Philippines 



FB3-2
Effects of Bi in Sn-Cu Based Lead-free Solder Alloys and Interconnects
Kazuhiro Nogita1, Arif Salleh1,2, Selena Smith1, Yueqin Wu1, Stuart McDonald1, Tetsuya Akaiwa3, Takatoshi Nishimura3, 1The University of Queensland / Australia, 2Universiti Malaysia Perlis / Malaysia, 3Nihon Superior / Japan

FB3-3
Effect of Substrate Metallization of Impact Strength on Sn-Ag-Cu Solder Bumps using Formic Acid Atmosphere
Siliang He, Hiroshi Nishikawa, Osaka University / Japan



FB3-4
Study on Temperature Dependence of Viscosity of Dispensing Solder Paste
Tetsuya Yamamoto, Yuchen Hsu, Akiya Kimura, Daisuke Hiratsuka, Toshiba / Japan
FC3: Substrate and Interposers
FC3-1
FEM Simulation of Warpage Orientation Change of FRP Polymer Substrate during Thermal Processing
Cheolgyu Kim1, Tae-Ik Lee2, Min Sun Kim1, Taek-Soo Kim1, 1KAIST, 2I-CONS / Korea

FC3-2
Low Dk/Df Polyimide Adhesives for Low Transmission Loss Substrates
Takashi Tasaki, Atsushi Shiotani, Takashi Yamaguchi, Keisuke Sugimoto, Arakawa Chemical Industries / Japan




FC3-3
Direct Copper Metallization on Glass Technology
Shigeo Onitake, Kotoku Inoue, Masatoshi Takayama, Takashi Kozuka, Koto Electric / Japan




FC3-4
Development of Through Glass Vias (TGV) and Through Quartz Vias (TQV) for Advanced Packaging
Kohei Horiuchi, Motoshi Ono, Yoichiro Sato, Shintaro Takahashi, Asahi Glass / Japan

FC3-5 Cancelled
High-Performance and Scalable FOWLP-Based Flexible Device Integration
T. Fukushima1,2, A. Alam1, S. Pal1, Z. Wan1, S. C. Jangam1, G. Ezhilarasu1, A. Bajwa1, S. S. Iyer1, 1UCLA / USA, 2Tohoku University / Japan
  
FD3: Printed Electronics-3
FD3-1 <Session Invited>
Feasible Monitoring Methods for Lung and Circulatory Functions using Wearable Sensors
Satoru Nebuya, Kitasato University / Japan



FD3-2 <Session Invited>
Stretchable and Robust Transistor of Single Wall Carbon Nanotube, Gel and Elastomeric Materials
Atsuko Sekiguchi, Fumiaki Tanaka, Don. N Futaba, Takeo Yamada, Kenji Hata, National Institute of Advanced Industrial Science and Technology / Japan



FD3-3 <Session Invited>
Fully-additive Manufacturing of Micro-hollowed Structures Based on Printing Method for MEMS Applications
Shusuke Kanazawa, Yasuyuki Kusaka, Noritaka Yamamoto, Hirobumi Ushijima, AIST / Japan


FD3-4 <Session Invited>
Design of Printed E-textile Probers to Suppress Electrocardiography Noise
Masahiro Inoue, Yusaku Amano, Yasunori Tada Gunma University / Japan
FE3: 3DIC Packaging-1
FE3-1 
<Session Invited>
Integrated Passive Device for TSV(Through-Silicon-Via) Interposer
Gu-Sung Kim, EPWorks/Kangnam University / Korea



FE3-2

Impact of Backside Process on High Aspect Ratio Via-Middle Cu Through Silicon Via Reliability
Yunlong Li, Stefaan Van Huylenbroeck, Joeri De Vos, Michele Stucchi, Kristof Croes, Gerald Beyer, Eric Beyne, imec / Belgium




FE3-3
Influence of Surface Properties on Adhesion Strength of Protective Film for RDL Process in Chip Size Packaging
Takuro Suyama, Kensuke Suga, Takatoshi Igarashi, Noriyuki Fujimori Olympus / Japan


FE3-4
Revisit the Electromigration Effect - in situ synchrotron X-ray and scanning electron microscopy and ab initio calculations
Shih-kang Lin1, Yu-chen Liu1, Shang-Jui Chiu2, Yen-Ting Liu2, Hsin-Yi Lee21National Cheng Kung University, 2National Synchrotron Radiation Research Center / Taiwan
15:10

15:20

Break
15:20






























16:35
FA4: Technology for High Speed Applications
FA4-1 <Session Invited>
Electronic Packaging Gears up for 5G Mobile Race
Toshihiko Nishio, SBR Technology / Japan




FA4-2 <Session Invited>
Advantage of Flip-Chip Bonding in Millimeter Wave Wireless System
Shohei Ishikawa, Atsushi onda, Toshihiro Shimura, Yoji Ohashi, Fujitsu Laboratories / Japan

FA4-3 <Session Invited>
Recent Trend of Layer-to-Layer Insulation Resin for High Speed and High Frequency Package
Shohei Fujishima, Ajinomoto Fine-Techno / Japan



FD4: Printed Electronics-4
FD4-1
Sub-micron Printing Technology using Seamless Roller Mold (SRM)
Kazuma Komatsu1, Shinya Matsubara1, Taishi Hitomi1, Kenjiro Okuno1, Keita Suzuki1, Shinji Matsui2, 1Asahi Kasei, 2University of Hyogo / Japan


FD4-2
Real-Time Observation of the Reception of Silver Ink in Soft Blanket Gravure Printing
Konami Izumi, Yasunori Yoshida, Shizuo Tokito, Yamagata University / Japan

FD4-3
Temperature Effects on Ink Transfer Performance of Gravure Offset Printing for Fine-line Circuitry
Yun-Hui Shen1, Hsien-Chie Cheng2, You-Wei Chen1, Su-Tsai Lu3, Shih-Ming Lin3, Wen-Hwa Chen1,
1National Tsing Hua University, 2Feng Chia University, 3Industrial Technology Research Institute / Taiwan
FE4: 3DIC Packaging-2
FE4-1
Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration
Cheng-Hsien Lu, Yi-Tung Kho, Chuan-An Cheng, Yen-Jun Huang, Kuan-Neng Cheng, National Chiao Tung University / Taiwan

FE4-2
A Design Guide of Thermal Resistance down to 30% for 3D Multi-stack Devices
Hiroyuki Ryoson, Koji Fujimoto, Takayuki Ohba, Tokyo Institute of Technology / Japan

FE4-3
3D-IC Thermo-Compression Collective Bonding Process Using High Temperature Stage
Noboru Asahi, Toshiyuki Jinda, Yoshihito Mizutani, Koichi Imai, Hikaru Tomita,Mikio Kawakami, Masafumi Senda, Katsumi Terada, Toray Engineering / Japan



Poster Session


P01


P02


P03


P04


P05


P06


P07


P08


P09


P10


P11


P12


P13


P14


P15


P16


P17


P18


P19


P20


P21

Simultaneous Printing of Interconnects with Different Line Width Using Soft Blanket Gravure Printing
Hiroyuki Nakamura, Yasunori Yoshida, Konami Izumi, Daisuke Kumaki, Shizuo Tokito, Yamagata University / Japan

Electromigration and Failure Analysis for Copper Pillar Bump in QFN Package
Yi-Shu Hsieh1, Shang-Lin Wu1, Kuan-I Cheng1, Sung-Mao Wu1, Tung-Bao Lu2, Liang-Tian Lu2, 1National University of Kaohsiung, 2ChipMOS Technologies / Taiwan

Thermal Stress Analysis of Chip with Pressure Sensor Embedded in Accelerometer
Chun-Lin Lu, Meng-Kao Yeh, National Tsing Hua University / Taiwan

Thermal Stress Analysis under Thermal Cycling Test for SiC Power Device Heat Dissipation Structures using Ag Sintered Layer
Kensuke Osonoe1, Masaaki Aoki1,2, Akihiro Mochizuki2, Yoshio Murakami2, Hitoshi Kida2, Goro Yoshinari2, Nobuhiko Nakano1, 1Keio University, 2 Alent Japan / Japan

Interfacial Reactions between Lead-free Solder and Cu-40Zn Alloys
Yee-Wen Yen, Pei-Yu Chen, Guan-Da Chen, National Taiwan University of Science and Technology / Taiwan

Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature Lead-free Solder and Gold-plated Electrode

Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama, Gunma University / Japan

Electrical Analysis and Solder Joint Quality of PCB Land-­pad Design for QFP E-­pad Packag
Kuan-I Cheng, Yi-Cheng Liu, Pai-Chou Liu, Sung-Mao Wu, National University of Kaohsiung / Taiwan

Effect of high temperature and humidity treatment on adhesion properties and bulk properties of structural adhesive
Yugo Tomita1, Ikuo Shohji1, Shinji Koyama1, Seigo Shimizu2, 1Gunma University, 2Fuji Heavy Industries /Japan

Effect of aging and test temperature on adhesion strength of copper and epoxy resin
Yu Tonozuka1, Ikuo Shohji1, Shinji Koyama1, Hiroaki Hokazono2, 1Gunma University, 2Fuji Electric / Japan

Effect of Anisotropic Mechanical Properties of Woven CompositeSubstrates on Warpage Orientation of Printed Circuit Boards
Tae-Ik Lee1, Cheolgyu Kim1, Jae-Bum Pyo1, Min Sung Kim2, Taek-Soo Kim1, 1KAIST, 2I-CONS / Korea

Properties of Carbon-doped TiO2 Nanofiber by Electrospinning
Sheng-Hung Shih, Yu-Min Chen, Cho-Liang Chung, Shen-Li Fu, I-Shou University / Taiwan

Preparation of Silicon-Yttrium-based oxide Nanofibers by Electrospinning
Wen-Yu Wang, Jui-Wen Liang, Cho-Liang Chung, Shen-Li Fu, I-Shou University / Taiwan

Eliminationg Surface Mount Issues due to Copper Smearing through Modified L- Lead Design
Dolores Milo, Mark Gerald Pinlac, Texas Instruments / Philippines

Electrochemical corrosion of copper and coper alloy in aqueous propylene glycol containing rust inhibitors
Kazunari Higuchi1, Ikuo Shohji1, Tetsuya Ando2, Koyama Shinji1, Keiichi Mizutani3, Yukio Inoue3, 1Gunma University, 2Muroran Institute of Technology, 3Showa / Japan

Simple Modeling Method of EMI Simulation for PCB
Mitsuharu Umekawa, Keysight Technologies Japan / Japan

Near-field to Far-field Transform Method by Using Kirchhoff Surface Integral Representation
Jing-Xin Chu, Sung-Mao Wu, Jia-Yu Liu, National University of Kaohsiung, Kaohsiung / Taiwan

Study on Magnetic Near-Field Noise and EMI of LED Light Bulb
Shunsuke Koyanagi1, Katsutoshi Saito1,2, Kazuki Muroi1, Motoshi Tanaka1, 1Akita University, 2Saikatu / Japan

An Investigation on Electromagnetic Environment In A Molding Factory
Yoshiteru Watanabe, Yuichi Abe, Tsuyoshi Haga, and Atsushi Maeda, Ibuki / Japan

A Tapered Loop Antenna with Broadband Characteristics for Ultra-Wideband Radio
Yuto Shimazaki1, Yudai Nagatsu1, Fukuro Koshiji1, Kohji Koshiji2, 1 Tokyo Polytechnic University, 2Tokyo University of Science / Japan

Transmission characteristics around Human Body Standing on the Electrode Located on the Floor Surface for Human Body Communication
Ryogo Urushidate1, Yusuke Fujita1, Fukuro Koshiji1, Kohji Koshiji2, 1Tokyo Polytechnic University, 2Tokyo University of Science / Japan

Compact Rumen pH Sensor: Aiming at the Realization of Electronic Cow Management and Fine Forage Strategy
Lan Zhang1, Jian Lu1, Hirofumi Nogami1,2, Hironao Okada1, Toshihiro Itoh1,3, 1National Institute of Advanced Industrial Science and Technology, 2Kyushu University, 3the University of Tokyo / Japan

*The content of the program may be subject to change without any prior notice. Please check the ICEP web site for an ipdated version.