General Information

2016 International Conference on Electronics Packaging (ICEP2016)
Conference: ICEP 2016
Date: April 20-22, 2016
Venue: Sapporo Education and Culture Hall

Important Date
September 1st, 2015: Abstract submission start
October 31, 2015: A 300-word abstract to be submitted to the web site 
The middle of December, 2015: Notification of acceptance
February 20, 2016: Final manuscript of two to six pages should be submitted, for both oral and poster presentations.

Call for Papers
We are waiting for your abstract submission.
Information of call for papers:  english ver.     Japanese ver.

A 300-word abstract to be submitted to the web site by October 31, 2015. Abstract submission web site will open on September, 2015. It is recommended to attach one piece of figure, picture or table. Notification of acceptance on December, 2015. Final manuscript to be submitted by February 20, 2016. Accepted and presented papers will be published in the conference proceedings and submitted to IEEE Xplore.
Abstract submission website is under construction. Please wait a moment!

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