2021 International Conference on Electronics Packaging
(ICEP 2021)
Date: May 12-14, 2021
Venue: The National Museum of Emerging Science and Innovation, Tokyo
Style: On-site & On-line Hybrid Conference


Call for Papers
We are waiting for your abstract submission.
Information of call for papers: English ver.  

Please prepare an abstract using the attached template to help us better evaluate your submission.
The abstract should contain about 1page of text and 1 page for supporting figures and tables, with a totallength of 2 pages at maximum.Figures and tables to support the point of the paper will receive positive considerations. Your abstract will be used for review purpose only and will not be included in the conference proceeding.

Thank you very much for your contribution!

According to the present status of COVID-19 over the world, the ICEP organizing committee has decided to cancel this year's excursion. Please look forward to next year's event.