About ICEP 2023

ICEP 2023 will be held from April 19 to 22, 2023 in Kumamoto, Kyushu area, Japan.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.


General Chair
Akitsu Shigetou, National Institute for Materials Science

General Vice Chair
Tomoyuki Hatakeyama, Toyama Prefectural University
Eiji Higurashi, Tohoku University
Mitsuyo Miyauchi, ALPHA-DESIGN

Technical Program Committee Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Technical Program Committee Vice Chair
Toyohiro Aoki, IBM Japan
Masahiro Aoyagi, Kumamoto University
Masahisa Fujino, National Institute of Advanced Industrial Science and Technology (AIST)
Shinya Takyu, LINTEC

Operation Committee Chair
Mitsuyo Miyauchi, ALPHA-DESIGN

Operation Committee Vice Chair
Ryo Endoh, Toray Research Center
Koichi Hirata, NAMICS
Taiji Sakai, FICT

Publication Chair
Kiyokazu Yasuda, Osaka University

Finance Chair
Akira Yamauchi, National Institute of Technology, Gunma College

Finance Vice Chair
Shoichi Ishikawa, JIEP
Taiji Sakai, Fujitsu Interconnect Technologies