About ICEP 2025

2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) from April 15 to 19, 2025 in Nagano, Japan.
ICEP is Japan's largest international conference on electronic packaging, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products and expand your customer network. JIEP jointly sponsors it, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.


General Chair
Taiji Sakai, FICT

General Vice Chair
Ryo Endoh, Rapidus
Takaaki Ishigure, Keio University
Yasuhiro Morikawa, ULVAC

Operation Committee Chair
Ryo Endoh, Rapidus

Operation Committee Vice Chair

Technical Program Committee Chair
Yasuhiro Morikawa, ULVAC

Technical Program Committee Vice Chair
Toyohiro Aoki, IBM Japan
Fumihiro Inoue, YOKOHAMA National University
Kai Takeuchi, Tohoku University

Publication Chair
Kiyokazu Yasuda, Osaka University

Finance Chair
Akira Yamauchi, National Institute of Technology, Gunma College

Promotion Chair
Yasumitsu Orii, Rapidus