About ICEP 2024

ICEP 2024 will be held from April 17 to 20, 2024 in Toyama, Japan.
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.


General Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

General Vice Chairs
Yasuhiro Morikawa, Ulvac
Taiji Sakai, FICT
Shinya Takyu, LINTEC