General Information

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC2018)

Date: April 17-21, 2018
Venue: Hotel Hanamizuki, Kuwana, Mie


Call for Papers
We are waiting for your abstract submission.
Information of call for papers: English ver.   Japanese ver.

Please prepare an abstract using the attached template to help us better evaluate your submission. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. Figures and tables to support the point of the paper will receive positive considerations. Your abstract will be used for review purpose only and will not be included in the conference proceeding.

Thank you very much for your contribution!

ICEP-IAAC 2018 Sponsor Opportunity
We invite you to be an official conference sponsor, which entitles your company to be exposed to the attendees in and outside the conference rooms. As a sponsor, your company's name and logo will be published in the conference official program, and will appear on the ICEP web site as well as various conference banners.

Important Date

The abstract submission open: August 1, 2017
The abstract deadline: October 31, November 17, 2017
Notification of acceptance: December 13, 2017
Final manuscript dead line: February 16, 2018