Keynote Lectures

Advanced Thinning and Cutting Technologies Enabling AI-Oriented Heterogeneous Integration

Youngsuk Kim
DISCO Corp.

Session time：
April 16 (Thu) 08:30 - 09:15

Abstract:
Heterogeneous integration technologies, including 2.5D/3D integration, hybrid copper bonding, fan-out (FO) wafer-level packaging (WLP), and panel-level packaging (PLP), have emerged as promising approaches to enhance device performance and integration density beyond conventional scaling. These advanced packaging schemes require substantial modifications to device architectures and manufacturing processes, which in turn elevate the importance of grinding and dicing technologies. To enable high-performance and high-yield heterogeneous integration, process optimizations such as ultra-thinning and high-precision cutting are critical. This presentation will discuss the current technical challenges and outlines future directions and potential solutions for grinding and dicing technologies in advanced packaging.

The Future of Computing

Norishige Morimoto
IBM Japan, Ltd.

Session time：
April 17 (Fri) 08:30 - 09:15

Abstract:
AI is no longer just a tool; it is becoming the core infrastructure driving technological and societal transformation. The rapid growth and adoption of AI technologies across industries show no sign of slowing down. Analyses show that the computational demands for AI have increased by a factor of 100 million in just 15 years. These advances bring new societal challenges that require innovative solutions.

IBM is exploring three key areas: Bits, Neurons, and Qubits. Bits represent advances in semiconductor technology, where continuous chip miniaturization enables cost efficiency, reduced power consumption, and enhanced computing capability. Neurons refer to next-generation AI chips inspired by the human brain, promising dramatic improvements in performance and energy efficiency. Qubits introduce quantum computing, which opens doors to entirely new scientific and technological frontiers through quantum-centric supercomputing techniques.

These technologies work together and complement each other to form the foundation of IBM’s vision for the future of computing. In this session, we will provide an overview of these innovations and share the latest updates on how they work together and complement each other to create new possibilities for the future of technology and our society.