About ICEP 2026

2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026) from April 14 to 18, 2026 in Hiroshima, Japan.
ICEP is Japan's largest international conference on electronic packaging, attracting more than 900 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products and expand your customer network. It is jointly sponsored by JIEP, IEEE EPS, IEEE EPS Japan Chapter, iMAPS, and SMTA. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

About ICEP 2026

Organization

General Chair

General Vice Chair