General Manager, 3D-Integration Technology Research Department
Association of Super-Advanced Electronics Technologies, Japan
"ASET Developments for the movement after Wide IO DRAM"
★ Dr. Wei-Chung Lo
Director, Industrial Technology Reserch Institute, Taiwan
★ Dr. Gu-Sung Kim
Founder & CEO, EPworks Co, Ltd.
Professor of Kangnam University, Korea
★ Dr. Frank Murray
CEO, IPDiA, France
★ Dr. John Knickerbocker
Distinguished Engineer, IBM Watson Research Center, USA
"3D Integration and Packaging for Systems"
★ Dr. Rajendra D. Pendse
Vice President & Chief Marketing Office, STATSChipPAC Inc, USA
"2.5D/3D - Recent Developments in Integration Approaches, Process Capability & Biz Models"
★ Mr. Rich Rice
Vice President, ASE US Inc, USA
"2.5D and 3D IC: Product and Supply Chain Readiness"
 |
 |
 |